Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes-Reference-Cited by-同舟云学术

Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes

Published:1999-01 Issue:7 Volume:13 Page:789-804
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Sung Yi ,Chee Yoon Yue ,Hsieh Jang-Hsing,Liwha Fong ,Lahiri Syamal K.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference18 articles.

1. Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

2. Ang, G. L., Goh, L. C., Heng, K. W. and Lahiri, S. K. 1995.Proceedings of the 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 218–221. Piscataway, NJ: IEEE.

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