1. L. Butkus, Environmental durability of adhesively bonded joints, Doctoral thesis, Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, 1997
2. Y. Cengel, M. Boles, Thermodynamics: An Engineering Approach (McGraw-Hill, New York, 1994)
3. K. Cho, E. Cho, Effect of the microstructure of copper oxide on the adhesion behavior or epoxy/copper leadframe joints. J. Adhes. Sci. Technol. 14(11), 1333–1353 (2000)
4. C. Chong, A. Leslie, L. Beng, C. Lee, Investigation on the effect of copper leadframe oxidation on package delamination, in Proceedings of the 45th Electronic Components and Technology Conference, (1995), pp. New York, N.Y. 463–469
5. P. Chung, M. Yuen, P. Chan, N. Ho, D. Lam, Effect of copper oxide on the adhesion behavior of epoxy molding compound-copper interface, in Proceedings of the 52nd Electronic Components and Technology Conference, 2002, pp. 1665–1670