Interfacial Microstructure between Copper Ribbon and Nickel-coated Copper Plate Formed by Ultrasonic Bonding
Author:
Publisher
Japan Welding Society
Subject
Metals and Alloys,Surfaces, Coatings and Films,Mechanical Engineering,Mechanics of Materials
Reference8 articles.
1. 1) Z. W. Zhong: "Overview of wire bonding using copper wire or insulated wire," Microelectron. Reliab., 51 (2011), 4-12.
2. 2) T. Uno: "Enhancing bondability with coated copper bonding wire," Microelectron. Reliab., 51 (2011), 88-96.
3. 3) M. Maeda, T. Sato, N. Inoue, D. Yagi and Y. Takahashi: "Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding," Microelectron. Reliab., 51 (2011), 130-136.
4. 4) M. Maeda, N. Inoue, T. Sato and Y. Takahashi: "Early stage of solid state interfacial reaction between copper and tin," Defect Diffus. Forum, 283-286 (2009), 323-328.
5. 5) Y. Takahashi and K. Inoue: "Recent void shrinkage models and their applicability to diffusion bonding," Mater. Sci. Technol., 8 (1992), 953-964.
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