Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode-Reference-Cited by-同舟云学术

Ultrasonic Weldability of Al Ribbon to Cu Sheet and the Dissimilar Joint Formation Mode

Published:2015 Issue:11 Volume:56 Page:1842-1851
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Zhang Guifeng¹²,Takahashi Yasuo²,Heng Zhonghao²,Takashima Kazumasa²,Misawa Kouta²

Affiliation:

1. State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University

2. Joining and Welding Research Institute, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/56/11/56_M2015251/_pdf

Reference26 articles.

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2. 2) G. G. Harman: Wire Bonding in Microelectronics, Materials, Processes, Reliability, and Yield, Second Edition, (McGraw-Hill, 1997) pp. 20–32.

3. 3) http://www24.casi.osaka-u.ac.jp/.

4. 4) Y. Takahashi and M. Maeda: Trans. JWRI 40 (2011) 1–7.

5. 5) Y. Takahashi: IEICE. Trans. Electron. J92-C(11) (2009) 581–594 (in Japanese).

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