A high electrical performance of DG-MOSFET transistors in 4H-SiC and 6H-SiC 130 nm technology by BSIM3v3 model

Author:

Hebali Mourad12,Bennaoum Menaouer13,Berka Mohammed14,Bey Abdelkader Baghdad15,Benzohra Mohammed6,Chalabi Djilali2,Saidane Abdelkader2

Affiliation:

1. Department of Electrotechnical , University Mustapha Stambouli Mascara , 29000 Mascara , Algeria

2. Laboratory: CaSiCCe , ENP Oran-MA, 31000 Oran , Algeria

3. Laboratoire de matriaux appliqus (AML) , Universit Djillali Liabs , 22000 Sidi Bel-Abbes , Algeria

4. Laboratory E.P.O , University of Sidi Bel-Abbes , 22000 Sidi Bel-Abbes , Algeria

5. Laboratory AMEL , University of Sidi Bel-Abbes , 22000 Sidi Bel-Abbes , Algeria

6. Department of Networking and Telecommunications , University of Rouen , Laboratory LECAP , 7600 , France

Abstract

Abstract In this paper, the electrical performance of double gate DG-MOSFET transistors in 4H-SiC and 6H-SiC technologies have been studied by BSIM3v3 model. In which the IV and g mV characteristics and subthreshold operation of the DGMOSFET have been investigated for two models (series and parallel) based on equivalent electronic circuits and the results so obtained are compared with the single gate SG-MOSFET, using 130 nm technology and OrCAD PSpice software. The electrical characterization of DG-MOSFETs transistors have shown that they operate under a low voltage less than 1.2 V and low power for both models like the SG-MOSFET transistor, especially the series DG-MOSFET transistor is characterized by an ultra low power. The different transistors are characterized by an ultra low OFF leakage current of pA order, very high ON/OFF ratio of and high subthreshold slope of order 0.1 V/dec for the transistors in 6H-SiC and 4H-SiC respectively. These transistors also proved higher transconductance efficiency, especially the parallel DG-MOSFET transistor.

Publisher

Walter de Gruyter GmbH

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