1. Tolliver, D.L., Nowitcki, R.S., Hess, D.W., et al., VLSI Electronics Microstructure Science, vol. 8: Plasma Processing for VLSI, Einspruch N.G. and Brawn, D.M., Eds., New York: Academic, 1984.
2. Wolf, S. and Tauber, R.N. Silicon Processing for the VLSI Era, vol. 1: Process Technology, New York: Lattice, 2000.
3. Efremov, A.M., Svettsov, V.I., Sitanov, D.V., and Balashov, D.I., Thin Solid Films, 2008, vol. 516, p. 4020.
4. Roosmalen, A.J., Baggerman, J.A.G., and Brader, S.J.H., Dry Etching for VLSI, New York: Plenum, 1991.
5. Efremov, A.M., Yudina, A.V., and Svettsov, V.I., High Temp., 2012, vol. 50, no. 1, p. 30.