1. Danilin, B.S. and Kireev, V.Yu., Primenenie nizkotemperaturnoi plazmy dlya travleniya i ochistki materialov (Application of Low Temperature Plasma for Etching and Cleaning of Materials), Danilin, B.S., Ed., Moscow: Energatomizdat, 1987.
2. Svettsov, V.I. and Efremov, A.M., Vakuumnaya i plazmennaya elektronika. Ucheb. posobie (Vacuum and Plasma Electronics: Textbook), Ivanovo: Ivanovsk. Gos. Khim.-Tekhnol. Univ., 2003.
3. Silicon Processing for the VLSI Era;S. Wolf,2000
4. Efremov, A.M. and Murin, D.B., Kinetics of heterogeneous decay of chlorine and hydrogen atoms in plasmas of HCl binary mixtures with Ar, H2, O2, and Cl2, High Energy Chem., 2015, vol. 49, no. 4, pp. 282–285. https://doi.org/10.1134/s0018143915040062
5. Efremov, A.M. and Murin, D.B., Electrophysical parameters of plasmas of binary mixtures HCl+Ar, He, H2, O2, and Cl2, Izvestiya Vysshikh Uchebnykh Zavedenii. Seriya Khimiya i Khimicheskaya Tekhnologiya, 2021, vol. 58, no. 4, pp. 14–18.