Highly heat-resistant poly(о-hydroxy amide) binders of polyfunctional composites for microelectronics-Reference-Cited by-同舟云学术

Highly heat-resistant poly(о-hydroxy amide) binders of polyfunctional composites for microelectronics

Published:2016-10 Issue:10 Volume:89 Page:1647-1654
ISSN:1070-4272
Container-title:Russian Journal of Applied Chemistry
language:en
Short-container-title:Russ J Appl Chem

Author:

Lebedeva G. K.,Bazhenova A. S.,Rudaya L. I.,Gofman I. V.,Marfichev A. Yu.,Bol’shakov M. N.,Sokolova I. M.,Chigirev D. S.,Ramsh S. M.,Shamanin V. V.

Publisher

Pleiades Publishing Ltd

Subject

General Chemical Engineering,General Chemistry

Link

http://link.springer.com/content/pdf/10.1134/S107042721610013X.pdf

Reference29 articles.

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4. Nanoscale Multifunctional Materials Science and Applications, Mukhopadhyay, M.S., Ed., New Jersey Wiley, 2012.

5. Omote, T., Photosensitive Polyimides: Molecular Design and Applications, Ghosh, M.K. and Mittal, K.L., Eds., New York: Marcel Dekker, 1996, pp. 121–149.

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