Highly Heat-Resistant Materials for Microelectronics: Hydrodynamic, Optical, and Conformational Properties of Fluorine Containing Poly(Amido-ortho-Hydroxy Amide)-Reference-Cited by-同舟云学术

Highly Heat-Resistant Materials for Microelectronics: Hydrodynamic, Optical, and Conformational Properties of Fluorine Containing Poly(Amido-ortho-Hydroxy Amide)

Published:2020-02 Issue:1 Volume:35 Page:223-230
ISSN:1000-2413
Container-title:Journal of Wuhan University of Technology-Mater. Sci. Ed.
language:en
Short-container-title:J. Wuhan Univ. Technol.-Mat. Sci. Edit.

Author:

Strelina Irina A,Rudaya Liudmila I,Okatova Ol’ga V,Bol’shakov Maxim N,Marfichev Aleksey Yu,Lebedeva Galina K,Shagayko Yuliya V,Ramsh Stanislav M

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s11595-020-2247-z.pdf

Reference15 articles.

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2. Cuadrado BD, Fernández AM, José G, et al. A Thermally Rearranged Polybenzoxazoles Made from Poly (ortho -hydroxyamide)s. Character-Ization and Evaluation as Gas Separation Membranes [J]. Reactive and Functional Polymers, 2018, 127: 38–47

3. Mukhin N, Afanasjev V, Sokolova I, et al. Heat-resistant Ferroelectric- polymer Nanocomposite with High Dielectric Constant [J]. Materials, 2018, 11: 1 439–1 447. https://doi.org/10.3390/ma11081439

4. Lebedeva GK, Bazhenova AS, Rudaya LI, et al. Highly Heat-resistant poly(o-hydroxy amides) Binders of Polyfunctional Composites for Microelectronics [J]. Rus. J. of Appl. Chemistry, 2016, 89: 1 647–1 654

5. Rudaja L, Shamanin V, Lebedeva C, et al. The Method of Producing of Heatresistant Positive Photoresists [P]v. Russian Federation Patent 2379731, 2010-01-20

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1. Highly Heat-Resistant Poly(Amido Hydroxy Amides) with Increased Elongation at Break and Photosensitive Formulations Based on Them;Russian Journal of Applied Chemistry;2022-04