Author:
Efremov A. M.,Murin D. B.,Kwon K.-H.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Wolf, S. and Tauber, R.N., Silicon Processing for the VLSI Era, Vol. 1: Process Technology, New York: Lattice, 2000.
2. Rooth, J.R., Industrial Plasma Engineering, Philadelphia: IOP Press, 2001.
3. Roosmalen, A.J., Baggerman, J.A.G., and Brader, S.J.H., Dry Etching for VLSI, New York: Plenum, 1991.
4. Lieberman, M.A. and Lichtenberg, A.J., Principles of Plasma Discharges and Materials Processing, New York: Wiley, 1994.
5. Yeom, G.Y. and Kushner, M.J., Si/SiO2 etch properties using CF4 and CHF3 in radio frequency cylindrical magnetron discharges, Appl. Phys. Lett., 1990, vol. 56, pp. 857–859.
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