Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Pasynkov, V.V. and Sorokin, V.S., Materialy elektronnoi tekhniki: uch. dlya stud. vuzov po spets. elektronnoi tekhniki (Materials of Electronic Engineering, The School-Book for Higher School), St. Petersburg: Lan’, 2001, p. 368.
2. Christophorou, L.G., Olthoff, J.K., and Wang, Y.J., Electron interaction with CCl2F2, Phys. Chem. Ref. Data, 1997, vol. 26, no. 5, pp. 1205–1237.
3. Stoffels, W.W., Stoffels, E., and Haverlag, M., The chemistry of a CCl2F2 radio frequency discharge, J. Vac. Sci. Technol., A, 1995, vol. 13, no. 4, pp. 2058–2066.
4. Lee, S.-K., Chun, S.-S., Hwang, C., and Lee, W.-J., Reactive ion etching mechanism of copper film in chlorine- based electron cyclotron resonance plasma, Jpn. J. Appl. Phys., 1997, vol. 36, pp. 50–55.
5. Dunaev, A.V. and Murin, D.B., Copper etching kinetics in a high-frequency discharge of freon R12, Russ. Microelectron., 2017, vol. 46, no. 4, pp. 261–266.
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