Photoemission and electronic structure of tungsten-based metallic glasses and alloys
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.44.12671/fulltext
Reference23 articles.
1. Failure temperature of amorphous Cu‐Ta alloys as diffusion barriers in Al‐Si contacts
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3. Electronic structure and properties of sputtered Ta-Cu films
4. High Resistivity of dc‐Sputtered Metal Films
5. Microstructure, growth, resistivity, and stresses in thin tungsten films deposited by rf sputtering
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