Failure temperature of amorphous Cu‐Ta alloys as diffusion barriers in Al‐Si contacts
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.95515
Reference4 articles.
1. Thermal stability data of amorphous binary alloys
2. Au diffusion in amorphous and polycrystalline Ni0.55Nb0.45
3. Stability of amorphous Fe-W alloys in multilayer metallizations on silicon
4. Barrier layers: Principles and applications in microelectronics
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