Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network

Published:2018-04-04 Issue:4 Volume:9 Page:
ISSN:2331-7019
Container-title:Physical Review Applied
language:en
Short-container-title:Phys. Rev. Applied

Author:

Valencia Daniel,Wilson Evan,Jiang Zhengping,Valencia-Zapata Gustavo A.,Wang Kuang-Chung,Klimeck Gerhard,Povolotskyi Michael

Funder

Microelectronics Advanced Research Corporation

Defense Advanced Research Projects Agency

U.S. Department of Energy

National Nuclear Security Administration

National Science Foundation

FAME Center

Publisher

American Physical Society (APS)

Subject

General Physics and Astronomy

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevApplied.9.044005/fulltext

Reference38 articles.

1. Resistivity dominated by surface scattering in sub-50 nm Cu wires

2. The conductivity of thin metallic films according to the electron theory of metals

3. ELECTRICAL RESISTIVITY MODEL FOR POLYCRYSTALLINE FILMS: THE CASE OF SPECULAR REFLECTION AT EXTERNAL SURFACES

4. Calculated Resistances of Single Grain Boundaries in Copper

5. Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Superconductivity of the grain boundaries in boron-doped nanocrystalline diamond;International Journal of Modern Physics B;2024-08-31

2. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15

3. Macromagnetic Approach to the Modeling in Time Domain of Magnetic Losses of Ring Cores of Soft Ferrites in Power Electronics;IEEE Transactions on Power Electronics;2023-03

4. Restructuring of emergent grain boundaries at free surfaces – An interplay between core stabilization and elastic stress generation;Acta Materialia;2023-01

5. First-principles prediction of electron grain boundary scattering in fcc metals;Applied Physics Letters;2022-06-13

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3