Electromigration-Induced Breakup of Two-Dimensional Voids
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.80.1674/fulltext
Reference13 articles.
1. Electromigration in metals
2. Electromigration and IC Interconnects
3. Electromigration failure by shape change of voids in bamboo lines
4. Numerical simulation of electromigration‐induced shape changes of voids in bamboo lines
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