Origin of Compressive Residual Stress in Polycrystalline Thin Films
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.88.156103/fulltext
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1. Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
2. The internal stress in thin silver, copper and gold films
3. Mechanical properties of thin films
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