Electromechanically driven chaotic dynamics of voids in metallic thin films
Author:
Publisher
American Physical Society (APS)
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.81.054111/fulltext
Reference39 articles.
1. Current-Induced Faceting of Crystal Surfaces
2. Dynamics of transgranular voids in metallic thin films under electromigration conditions
3. Stability of a circular void in a passivated, current‐carrying metal film
4. Surface Electromigration as a Moving Boundary Value Problem
5. A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electromigration-driven complex dynamics of void surfaces in stressed metallic thin films under a general biaxial mechanical loading;Journal of Applied Physics;2012-10-15
2. Effect of applied stress tensor anisotropy on the electromechanically driven complex dynamics of void surfaces in metallic thin films;Journal of Applied Physics;2011-09-15
3. Surface morphological response of crystalline solids to mechanical stresses and electric fields;Surface Science Reports;2011-08
4. Analysis of current-driven motion of morphologically stable voids in metallic thin films: Steady and time-periodic states;Journal of Applied Physics;2010-09
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