Analysis of current-driven motion of morphologically stable voids in metallic thin films: Steady and time-periodic states
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3476263
Reference32 articles.
1. Motion of Inclusion Induced by a Direct Current and a Temperature Gradient
2. Electromigration in metals
3. Electromigration and IC Interconnects
4. Morphology of electromigration-induced damage and failure in Al alloy thin film conductors
5. Slit morphology of electromigration induced open circuit failures in fine line conductors
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1. Scale effect on migration and coalescence of void in piezoelectric film subjected to gradient stress and electric fields;International Journal of Damage Mechanics;2014-11-04
2. Anisotropy of electromigration-induced void and island drift;Journal of Physics: Condensed Matter;2013-12-20
3. Current-driven morphological evolution of single-layer epitaxial islands on crystalline substrates;Surface Science;2013-12
4. Surface morphological response of crystalline solids to mechanical stresses and electric fields;Surface Science Reports;2011-08
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