Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.53.16027/fulltext
Reference24 articles.
1. Principles of Electronic Packaging
2. Constitution of Binary Alloys
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