Molecular design of a highly matched and bonded interface achieves enhanced thermal boundary conductance-Reference-Cited by-同舟云学术

Molecular design of a highly matched and bonded interface achieves enhanced thermal boundary conductance

Published:2023 Issue:19 Volume:15 Page:8706-8715
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Wang Shuting¹,Ren LinLin¹,Han Meng¹,Zhou Wei¹^ORCID,Wong Chunyu¹^ORCID,Bai Xue¹,Sun Rong¹^ORCID,Zeng Xiaoliang¹^ORCID

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

Abstract

Thermal boundary conductance of copolymer of polyurethane and thioctic acid with aluminum (Al) interface shows a remarkable increase 2–5 times than that of traditional polymers/Al interfaces owing to the highly matched and bonded interface.

Funder

Basic and Applied Basic Research Foundation of Guangdong Province

National Natural Science Foundation of China

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2023/NR/D3NR00627A

Reference48 articles.

1. Emerging challenges and materials for thermal management of electronics