Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays-Reference-Cited by-同舟云学术

Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays

Published:2023 Issue:10 Volume:25 Page:7407-7416
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Ma Zhigao¹²,Jiang Bingyan¹²,Dong Yanzhuo¹²,Qiang Jun¹²,Drummer Dietmar³,Zhang Lu¹²^ORCID

Affiliation:

1. School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

2. State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China

3. Institute of Polymer Technology, Friedrich-Alexander-University Erlangen-Nuremberg, Am Weichselgarten 9, D-91058 Erlangen, Germany

Abstract

Due to the confined mass transfer capability in a microchannel, void defects are easily formed in the electroformed microcolumn array with a high depth/width ratio, which seriously affects the life and performance of micro-devices.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2023/CP/D2CP05396A

Reference26 articles.

1. A titer plate-based polymer microfluidic platform for high throughput nucleic acid purification

2. Analysis of mold insert fabrication for the processing of microfluidic chip

3. Research on the process of fabricating a multi-layer metal micro-structure based on UV-LIGA overlay technology

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