Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process-Reference-Cited by-同舟云学术

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Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process

Published:2016-01-13 Issue:1 Volume:7 Page:7
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Du Liqun,Yang Tong,Zhao Ming,Tao Yousheng,Luo Lei,Wang Lei,Liu Chong

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

http://www.mdpi.com/2072-666X/7/1/7/pdf

Reference22 articles.

1. Chip-based Reversed-phase Liquid Chromatography−Mass Spectrometry of Permethylated N-Linked Glycans: A Potential Methodology for Cancer-biomarker Discovery

2. Detection of allergen specific immunoglobulins by microarrays coupled to microfluidics

3. Lensfree Holographic Imaging of Antibody Microarrays for High-Throughput Detection of Leukocyte Numbers and Function

4. Integration of single cell injection, cell lysis, separation and detection of intracellular constituents on a microfluidic chipElectronic supplementary information (ESI) available: Video showing a single erythrocyte transported through the microchannel, docking (adhering) at a particular point and then being lysed. See http://www.rsc.org/suppdata/lc/b3/b310552k/

5. Study on Electric Driven Bidirectional Bistable Micro Relay and Its Integrated Manufacturing Process;Wu,2011

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1. Lab-on-a-chip: A Novel Platform for Disease Diagnosis;Lab-on-a-chip Devices for Advanced Biomedicines;2024-08-14

2. Improving uniformity and performance of electroformed copper using rare earth element additives;International Journal of Electrochemical Science;2024-05

3. Fabrication and characterization of Ni-Co-TiN/ CeO2 composite coating by ultrasonic vibration-assisted jet electrodeposition;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-04

4. Mass transfer characteristics at cathode/electrolyte interface during electrodeposition of nickel microcolumns with various aspect ratios;Journal of Micromechanics and Microengineering;2023-08-22

5. An Effect of Layered Auxiliary Cathode on Thickness Uniformity in Micro Electroforming Process;Micromachines;2023-06-25

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