An Effect of Layered Auxiliary Cathode on Thickness Uniformity in Micro Electroforming Process

Author:

Wang Huan12,Xing Jianpeng1,Fan Tao1,Liu Jinhu1,Xie Jing12ORCID,Li Chaobo12

Affiliation:

1. Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

Thickness nonuniformity is a bottleneck in the micro electroforming process of micro-metal devices. In this paper, a new method of fabricating a layered auxiliary cathode is proposed to improve the thickness uniformity of a micro-electroforming layer. In order to analyze the general applicability of the proposed method, four basic microstructures, namely circular, square, regular triangular, and regular hexagonal were used to study the effect of a layered auxiliary cathode on thickness uniformity through simulation and experimentation. The simulation results showed that with the help of the proposed auxiliary cathode, the thickness nonuniformity of four microstructures should decrease due to the reduced edge effect of the current density. The experimental results showed that the thickness uniformity of four microstructures fabricated via the proposed method was improved by 190.63%, 116.74%, 80.43%, and 164.30% compared to that fabricated via the traditional method, respectively. Meanwhile, the micro-gear was fabricated and the nonuniformity was reduced by 101.15% using the proposed method.

Funder

Chinese Academy of Sciences

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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