Ultrasonic bonding method for heterogeneous microstructures using self-balancing jig-Reference-Cited by-同舟云学术

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Ultrasonic bonding method for heterogeneous microstructures using self-balancing jig

Published:2015 Issue:6 Volume:15 Page:1412-1416
ISSN:1473-0197
Container-title:Lab on a Chip
language:en
Short-container-title:Lab Chip

Author:

Lee Kyoung G.¹²³⁴,Shin Sujeong¹²³⁴,Kim Byeong Il⁵⁶⁴,Bae Nam Ho¹²³⁴,Lee Moon-Keun¹²³⁴,Lee Seok Jae¹²³⁴,Lee Tae Jae¹²³⁴

Affiliation:

1. Department of Nano Bio Research

2. National Nanofab Center

3. Daejeon 305-806

4. Republic of Korea

5. T&S R&D Center

6. Gumi-si

Abstract

Self-balancing jig has been adapted for fabricating and bonding of heterogeneous microstructures in thermoplastic-based microfluidic device.

Publisher

Royal Society of Chemistry (RSC)

Subject

Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2015/LC/C4LC01473A

Reference17 articles.

1. Thermoplastic microfluidic devices and their applications in protein and DNA analysis

2. Continuous In Situ Synthesis of ZnSe/ZnS Core/Shell Quantum Dots in a Microfluidic Reaction System and its Application for Light-Emitting Diodes

3. Microfluidic Chips for Point-of-Care Immunodiagnostics

4. Thermoplastic elastomers for microfluidics: Towards a high-throughput fabrication method of multilayered microfluidic devices

5. Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices

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1. Recent Advances in Thermoplastic Microfluidic Bonding;Micromachines;2022-03-20

2. Ultrasonic bonding method controlled by the characteristic waveform of ultrasonic propagation;Micro & Nano Letters;2019-05

3. Energy director structure and self‐balancing jig for the ultrasonic bonding of microfluidic chips;Micro & Nano Letters;2017-07

4. Thiol–ene–epoxy thermoset for low-temperature bonding to biofunctionalized microarray surfaces;Lab Chip;2017

5. Fabrication Techniques for Production of Thermoplastic-Based Microfluidics Devices;Journal of Molecular and Engineering Materials;2016-09

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