Ultrasonic bonding method controlled by the characteristic waveform of ultrasonic propagation-Reference-Cited by-同舟云学术

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Ultrasonic bonding method controlled by the characteristic waveform of ultrasonic propagation

Published:2019-05 Issue:5 Volume:14 Page:547-550
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Sun Yibo¹²,Teng Tiandong¹,Guo Guoqing³,Wu Guoxiong²

Affiliation:

1. School of Locomotive & Vehicle EngineeringDalian Jiaotong UniversityDalian116028People's Republic of China

2. Suzhou Dongling Vibration Test Instrument Co., LtdDalianPeople's Republic of China

3. Shenyang Railway Signal Co., LtdShenyangPeople's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2018.5461

Reference14 articles.

1. Micro total analysis systems: latest achievements;West J.;Anal. Chem.,2008

2. Review on ultrasonic fabrication of polymer micro devices

3. Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips

4. Ultrasonic Bonding for MEMS Sealing and Packaging

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3. The Fabrication and Bonding of Thermoplastic Microfluidics: A Review;Materials;2022-09-18

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