Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder-Reference-Cited by-同舟云学术

Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

Published:2015 Issue:120 Volume:5 Page:99058-99064
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Nordin N. I. M.¹²³⁴,Said S. M.⁵²³⁴,Ramli R.¹²³⁴,Weide-Zaage K.⁶⁷⁸⁹,Sabri M. F. M.¹²³⁴,Mamat A.¹²³⁴,Ibrahim N. N. S.¹⁰¹¹¹²¹³⁴,Mainal A.¹⁴²³⁴,Datta R. S.⁵²³⁴

Affiliation:

1. Department of Mechanical Engineering

2. University of Malaya

3. 50603 Kuala Lumpur

4. Malaysia

5. Department of Electrical Engineering

6. RESRI Group Institute of Microelectronic Systems (IMS)

7. Leibniz Universität Hannover

8. 30167 Hannover

9. Germany

10. Product Quality & Reliability Engineering (PQRE) Laboratory

11. Malaysian Institute of Microelectronic Systems (MIMOS) Berhad

12. Technology Park Malaysia

13. Kuala Lumpur 57000

14. Department of Chemistry

Abstract

(a) Al provides an enhanced passivation capability over SAC105 solder alloy. (b) Corrosion products on the surface consist of Al₂CuO₄, Al₂O₃, SnO and SnO₂. (c) Al-added SAC105 is less susceptible to corrosion.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA18453C

Reference26 articles.

1. Lead-free Solders in Microelectronics

2. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

3. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review

4. Lead (Pb)-free solders for electronic packaging

5. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

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