Pressure-assisted electrode fabrication using simply synthesized Cu3Sn alloy nanoparticles-Reference-Cited by-同舟云学术

Pressure-assisted electrode fabrication using simply synthesized Cu3Sn alloy nanoparticles

Published:2015 Issue:12 Volume:3 Page:2773-2777
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Cho Sanghun¹²³⁴⁵,Lim Keon-Hee¹²³⁴⁵,Park Si Yun¹²³⁴⁵,Yin Zhenxing¹²³⁴⁵,Yoo Jeeyoung¹²³⁴⁵,Kim Youn Sang¹²³⁴⁵

Affiliation:

1. Program in Nano Science and Technology

2. Graduate School of Convergence Science and Technology

3. Seoul National University

4. Seoul 151-742

5. Korea

Abstract

We suggest the simple one-pot synthesis of Cu₃Sn nanoparticles with high oxidation-resistivity, good electron conductivity and easy process-ability. In addition, we introduce the fabrication of pressure-assisted electrode at room temperature, which have a good potential for various functional devices on a plastic substrate.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/TC/C5TC00215J

Reference27 articles.

1. Ru–Pt core–shell nanoparticles for preferential oxidation of carbon monoxide in hydrogen

2. Pt-Cu Core-Shell and Alloy Nanoparticles for Heterogeneous NOx Reduction: Anomalous Stability and Reactivity of a Core-Shell Nanostructure

3. One-Pot Protocol for Au-Based Hybrid Magnetic Nanostructures via a Noble-Metal-Induced Reduction Process

4. Alloy Formation of Gold−Silver Nanoparticles and the Dependence of the Plasmon Absorption on Their Composition

5. Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Geometrical features, stability and electronic properties of (Cu3Sn)n clusters;Inorganica Chimica Acta;2024-12

2. Effects of Sn-containing intermetallic compounds on the thermal decomposition and ignition properties of RDX and TKX-50;Journal of Alloys and Compounds;2022-12

3. Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu₃Sn Paste for High-Power Electronics Packaging;ACS Applied Electronic Materials;2022-07-05

4. Orientation-dependent transport properties of Cu3Sn;Acta Materialia;2022-04

5. Facile synthesis of Cu10Sn3 nanoparticles and their sintering behavior for power device packaging;Results in Materials;2021-06