Facile synthesis of Cu10Sn3 nanoparticles and their sintering behavior for power device packaging

Author:

Guo Longjun,Liu Wei,Ji Xiaoliang,Wang Chunqing

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference26 articles.

1. A review of SiC power module packaging: layout material system and integration;Chen;CPSS Trans. Power Electron. Appl.,2017

2. K. Hamada, SiC device and power module technologies for environmentally friendly vehicles. In: Proceedings of 7th International Conference on Integrated Power Electronics Systems, March 6–8, 2012, Nuremberg, Germany, pp. 473–477.

3. High-temperature operation of diamond junction field-effect transistors with lateral p-n junctions;Iwasaki;IEEE Electron. Device Lett.,2013

4. Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging;Chia;J. Mater. Sci. Mater. Electron.,2015

5. Materials and processes for implementing hightemperature liquid interconnects;Mannan;IEEE Trans. Adv. Packag.,2004

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