Remediation for TXRF saturation effects on microdroplet residues from preconcentration methods on semiconductor wafers
Author:
Publisher
Royal Society of Chemistry (RSC)
Subject
Spectroscopy,Analytical Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2005/JA/B502208H
Reference20 articles.
1. Trace-analytical methods for monitoring contaminations in semiconductor-grade Si manufacturing
2. Determination of ultra trace contaminants on silicon wafer surfaces using total-reflection X-ray fluorescence TXRF ‘state-of-the-art’
3. Low‐Temperature Out‐Diffusion of Cu from Silicon Wafers
4. Validation of vapor phase decomposition–droplet collection–total reflection X-ray fluorescence spectrometry for metallic contamination analysis of silicon wafers
5. Determination of metallic contaminants on Ge wafers using direct- and droplet sandwich etch-total reflection X-ray fluorescence spectrometry
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