Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties-Reference-Cited by-同舟云学术

Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties

Published:2013 Issue:25 Volume:1 Page:3961
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Goethals Frederik,Levrau Elisabeth,Pollefeyt Glenn,Baklanov Mikhail R.,Ciofi Ivan,Vanstreels Kris,Detavernier Christophe,Van Driessche Isabel,Van Der Voort Pascal

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2013/TC/C3TC30522H

Reference27 articles.

1. Challenges of back end of the line for sub 65 nm generation

2. Periodic Mesoporous Organosilicas: from simple to complex bridges; a comprehensive overview of functions, morphologies and applications

3. Materials chemistry for low-k materials

4. Low Dielectric Constant Materials

5. Low dielectric constant materials for microelectronics

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