Materials chemistry for low-k materials-Reference-Cited by-同舟云学术

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Materials chemistry for low-k materials

Published:2006-03 Issue:3 Volume:9 Page:22-31
ISSN:1369-7021
Container-title:Materials Today
language:en
Short-container-title:Materials Today

Author:

Hatton Benjamin D.,Landskron Kai,Hunks William J.,Bennett Mark R.,Shukaris Donna,Perovic Douglas D.,Ozin Geoffrey A.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference79 articles.

1. In Search of Low- k Dielectrics

2. Overview on Low Dielectric Constant Materials for IC Applications;Ho,2003

3. Low dielectric constant materials for microelectronics

4. Challenges in the implementation of low-k dielectrics in the back-end of line

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1. Comprehensive Review on the Impact of Chemical Composition, Plasma Treatment, and Vacuum Ultraviolet (VUV) Irradiation on the Electrical Properties of Organosilicate Films;Polymers;2024-08-05

2. High‐performance cross‐linked SiCOH/polyimide composite film with an ultralow dielectric constant at high frequency;Journal of Applied Polymer Science;2024-07-18

3. Synthesis of low-k SiONC thin films by plasma-assisted molecular layer deposition with tetraisocyanatesilane and phloroglucinol;Nanotechnology;2024-07-18

4. Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration;Chemical Reviews;2024-06-07

5. Remote plasma chemical vapor deposition of silicon oxycarbide film with a styrene-containing precursor and in situ O2 plasma treatment;Thin Solid Films;2024-06

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