High dielectric constant and high breakdown strength polyimide <i>via</i> tin complexation of the polyamide acid precursor-Reference-Cited by-同舟云学术

High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor

Published:2022 Issue:15 Volume:12 Page:9095-9100
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Alamri Abdullah¹^ORCID,Wu Chao¹²,Nasreen Shamima¹^ORCID,Tran Huan³,Yassin Omer¹,Gentile Ryan¹,Kamal Deepak³,Ramprasad Rampi³,Cao Yang¹²^ORCID,Sotzing Gregory¹⁴

Affiliation:

1. Institute of Materials Science, University of Connecticut, USA

2. Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, USA

3. School of Materials Science and Engineering, Georgia Institute of Technology, USA

4. Department of Chemistry, University of Connecticut, USA

Abstract

Polyimide with high dielectric constant and breakdown strength is synthesized via tin complexation of the polyamide acid precursor. Sn–O bonds with high atomic polarizability are intended to enhance the ionic polarization without sacrificing bandgap.

Funder

Office of Naval Research

Jazan University

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/RA/D1RA06302B

Reference33 articles.

1. Low-Dielectric, Nanoporous Organosilicate Films Prepared via Inorganic/Organic Polymer Hybrid Templates

2. High-Performance Flexible Transparent Thin-Film Transistors Using a Hybrid Gate Dielectric and an Amorphous Zinc Indium Tin Oxide Channel