4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper-Reference-Cited by-同舟云学术

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

Author:

Tang Mingxing¹²³⁴,Zhang Shengtao¹²³⁴^ORCID,Qiang Yujie¹²³⁴,Chen Shijin⁵⁶⁷⁴,Luo Li¹²³⁴,Gao Jingyao⁸⁹¹⁰⁴,Feng Li¹²³⁴,Qin Zhongjian¹²³⁴

Affiliation:

1. School of Chemistry and Chemical Engineering

2. Chongqing University

3. Chongqing 400044

4. P. R. China

5. Research and Development Department

6. Guangdong Bomin Sci-Tech Co., Ltd.

7. Meizhou 514000

8. State Key Lab of Electronic Thin Films and Integrated Devices

9. University of Electronic Science and Technology of China (UESTC)

10. Chengdu 610054

Abstract

Filling performance of microvia was defined as following equation: η = (A/B) × 100%.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

Reference67 articles.

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