Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing-Reference-Cited by-同舟云学术

Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing

Published:2022 Issue:20 Volume:4 Page:4263-4271
ISSN:2516-0230
Container-title:Nanoscale Advances
language:en
Short-container-title:Nanoscale Adv.

Author:

Liu Dongdong¹²,Zhang Zhenyu¹^ORCID,Feng Jiajian¹³,Yu Zhibin¹²,Meng Fanning¹⁴,Xu Guanghong¹⁴,Wang Jianmei⁵,Wen Wei⁶,Liu Wei²

Affiliation:

1. Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

2. Division of Energy Research Resources, Dalian National Laboratory for Clean Energy, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian, Liaoning 116023, China

3. Foshan Tanzhituo Advanced Intelligent Equipment Co., Ltd, Foshan 528203, China

4. Dianxi Research Institute of Dalian University of Technology, Baoshan 678000, China

5. Engineering Research Center Heavy Machinery Ministry of Education, Taiyuan University of Science and Technology, Taiyuan, 030024, China

6. College of Mechanical and Electrical Engineering, Hainan University, Haikou 570228, China

Abstract

Schematic diagram of chemical mechanical polishing on oxygen-free copper: (a) the pristine surface prior to CMP, (b) the chemical reaction, (c) mechanical removal and (d) atomic-level ultra-smooth surface after CMP.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Yunnan Provincial Science and Technology Department

Changjiang Scholar Program of Chinese Ministry of Education

Dalian University of Technology

Collaborative Innovation Center of Major Machine Manufacturing in Liaoning

Publisher

Royal Society of Chemistry (RSC)

Subject

General Engineering,General Materials Science,General Chemistry,Atomic and Molecular Physics, and Optics,Bioengineering

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