Green chemical mechanical polishing of sapphire wafers using a novel slurry-Reference-Cited by-同舟云学术

Green chemical mechanical polishing of sapphire wafers using a novel slurry

Published:2020 Issue:44 Volume:12 Page:22518-22526
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Xie Wenxiang¹²³⁴⁵,Zhang Zhenyu¹²³⁴^ORCID,Liao Longxing¹²³⁴,Liu Jie¹²³⁴,Su Hongjiu⁵⁶⁷⁸⁴,Wang Shudong⁵⁶⁷⁸⁴,Guo Dongming¹²³⁴

Affiliation:

1. Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education

2. Dalian University of Technology

3. Dalian 116024

4. China

5. Dalian National Laboratory for Clean Energy

6. Dalian Institute of Chemical Physics

7. Chinese Academy of Sciences

8. Dalian 116023

Abstract

Toxic and corrosive solutions are widely used in the preparation of abrasives and chemical mechanical polishing (CMP) of sapphire wafers, resulting in potential environmental pollution.

Funder

National Key Research and Development Program of China

Changjiang Scholar Program of Chinese Ministry of Education

Dalian University of Technology

Collaborative Innovation Center of Major Machine Manufacturing in Liaoning

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2020/NR/D0NR04705H

Reference46 articles.

1. The Core Structure of Basal Dislocations in Deformed Sapphire (α-Al 2 O 3 )

2. Macroscopic 10-Terabit–per–Square-Inch Arrays from Block Copolymers with Lateral Order

3. Atmospheric pressure plasma enabled polishing of single crystal sapphire

4. Epitaxial diamond growth on sapphire in an oxidizing environment

5. Nonstoichiometric Dislocation Cores in α-Alumina

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