Robust spin-on-glass poly(methyl)silsesquioxane-based low-k materials derived from a cyclic siloxane precursor
Author:
Affiliation:
1. Materials Architecturing Research Center
2. Korea Institute of Science and Technology
3. Seoul 136-791
4. Republic of Korea
5. Nanomaterials Science and Engineering
Abstract
Low dielectric constant poly(methyl)silsesquioxane spin-on-glass resins incorporating a cyclic precursor exhibited exceptional mechanical properties to withstand CMP processes.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA11110B
Reference27 articles.
1. Low Dielectric Constant Materials
2. Molecular Network Reinforcement of Sol–Gel Glasses
3. Application of the Protection/Deprotection Strategy to the Science of Porous Materials
4. High-performance ultralow dielectric constant carbon-bridged mesoporous organosilica films for advanced interconnects
5. Film Property Requirements for Hermetic Low-k a-SiOxCyNz:H Dielectric Barriers
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