Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction-Reference-Cited by-同舟云学术

Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction

Author:

Liu Shaoqing¹²³⁴⁵,Zhao Bo¹²³⁴,Jiang Li¹²³⁴⁵,Zhu Yan-Wu⁵⁶⁷⁴,Fu Xian-Zhu¹²³⁴⁸^ORCID,Sun Rong¹²³⁴,Xu Jian-Bin⁹¹⁰⁴,Wong Ching-Ping⁹¹⁰⁴¹¹¹²

Affiliation:

1. Shenzhen Institutes of Advanced Technology

2. Chinese Academy of Sciences

3. Shenzhen 518055

4. China

5. Institute of Nano Science and Technology

6. University of Science and Technology of China

7. Suzhou 215123

8. College of Materials Science and Engineering

9. Department of Electronics Engineering

10. The Chinese University of Hong Kong

11. School of Materials Science and Engineering

12. Georgia Institute of Technology

Abstract

3D core–shell Cu@rGO filled polymer composites with high thermal conductivity for advanced electronic packaging techniques.

Funder

National Natural Science Foundation of China

Guangdong Science and Technology Department

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

Reference46 articles.

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