Electrothermal Curable Epoxy Interface Adhesive Composite with Low Voltage: An Ideal Thermal Management and EMI Shielding Material
Author:
Affiliation:
1. The State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, China
2. College of Materials Science and Engineering, Guiyang University, Guiyang 550000, China
Funder
State Key Laboratory of Polymer Materials Engineering
National Natural Science Foundation of China
Guizhou Key Laboratory of Advanced Low Dimensional Green Energy Storage Materials in Universities
Publisher
American Chemical Society (ACS)
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.4c01697
Reference55 articles.
1. Robust Itaconic Acid-Based Polymer Adhesive Nanocomposites Containing Bioinspired Multiple Hydrogen Bonds at the Polymer–Nanofiller Interface
2. Mode I tensile fracture behavior of adhesively-bonded metal–metal, metal–CFRP, and CFRP–CFRP bi-material combinations analyzed by size effect method
3. Contact Electrification at Adhesive Interface: Boosting Charge Transfer for High‐Performance Triboelectric Nanogenerators
4. Ultrastretchable and adhesive MXene-based hydrogel for high-performance strain sensing and self-powered application
5. Polydopamine as a Materials Platform to Promote Strong and Durable Interfaces in Thermoplastic Polymer‐Titanium Joints
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