Micro heat pipe device utilizing extended nanofluidics-Reference-Cited by-同舟云学术

Micro heat pipe device utilizing extended nanofluidics

Published:2017 Issue:80 Volume:7 Page:50591-50597
ISSN:2046-2069
Container-title:RSC Adv.
language:en
Short-container-title:RSC Adv.

Author:

Wang Chenxi¹²³⁴^ORCID,Kazoe Yutaka⁵⁶⁷⁸⁹^ORCID,Morikawa Kyojiro⁵⁶⁷⁸⁹^ORCID,Shimizu Hisashi⁵⁶⁷⁸⁹^ORCID,Pihosh Yuriy⁵⁶⁷⁸⁹^ORCID,Mawatari Kazuma⁵⁶⁷⁸⁹^ORCID,Kitamori Takehiko⁵⁶⁷⁸⁹^ORCID

Affiliation:

1. State Key Laboratory of Welding and Joining

2. Harbin Institute of Technology

3. Harbin 150001

4. China

5. Department of Applied Chemistry

6. School of Engineering

7. The University of Tokyo

8. Tokyo 113-8656

9. Japan

Abstract

A micro heat pipe device based on enhanced condensation on the extended nanopillars and liquid transport in the extended nanochannels.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Core Research for Evolutional Science and Technology

Hei Long Jiang Postdoctoral Foundation

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/RA/C7RA10017E

Reference31 articles.

1. A critical review of traditional and emerging techniques and fluids for electronics cooling

2. Recent advances in MEMS-based micro heat pipes

3. 3D-printed fluidic networks for high-power-density heat-managing miniaturized redox flow batteries

4. Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

5. Cooling a Microprocessor Chip

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