Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties
Author:
Affiliation:
1. School of Electrical and Electronic Engineering
2. Nanyang Technological University
3. Singapore
4. Institute of NanoScience & Technology
5. Habitat Centre
Abstract
Growth of CNT bundles on Cu-metal lines through oxide vias and the precise estimation of Cu–CNT contact resistance.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2015/TA/C4TA04715J
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