A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds-Reference-Cited by-同舟云学术

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A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Published:2017-05-02 Issue:2 Volume:2 Page:025003
ISSN:2058-8585
Container-title:Flexible and Printed Electronics
language:
Short-container-title:Flex. Print. Electron.

Author:

Jiang Di,Sun Shuangxi,Edwards Michael,Jeppson Kjell,Wang Nan,Fu Yifeng,Liu Johan

Funder

European Commission

Chalmers Tekniska H??gskola

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1088/2058-8585/aa6a82/pdf

Reference25 articles.

1. Nanowire active-matrix circuitry for low-voltage macroscale artificial skin

2. A hemispherical electronic eye camera based on compressible silicon optoelectronics

3. Active Devices Based on Organic Semiconductors for Wearable Applications

4. Multilayer high density flex technology

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1. Carbon Nanotubes for Nanoelectronics and Microelectronic Devices;Handbook of Carbon Nanotubes;2022

2. Carbon Nanotubes for Nanoelectronics and Microelectronic Devices;Handbook of Carbon Nanotubes;2022

3. Integration of Ultra-Low Volume Pneumatic Microfluidics with a Three-Dimensional Electrode Network for On-Chip Biochemical Sensing;Micromachines;2021-06-28

4. Through-Silicon-Via Interposers with Cu-Level Electrical Conductivity and Si-Level Thermal Expansion Based on Carbon Nanotube-Cu Composites for Microelectronic Packaging Applications;ACS Applied Nano Materials;2020-12-29

5. CNT sponges with outstanding absorption capacity and electrical properties: Impact of the CVD parameters on the product structure;Ceramics International;2019-08

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