Structural, mechanical, thermodynamic and electronic properties of AgIn2 and Ag3In intermetallic compounds: ab initio investigation-Reference-Cited by-同舟云学术

Structural, mechanical, thermodynamic and electronic properties of AgIn2 and Ag3In intermetallic compounds: ab initio investigation

Published:2015 Issue:86 Volume:5 Page:70609-70618
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Yu Ching-Feng¹²³⁴,Cheng Hsien-Chie⁵⁶⁷⁴,Chen Wen-Hwa¹²³⁴

Affiliation:

1. Department of Power Mechanical Engineering

2. National Tsing Hua University

3. Hsinchu 30013

4. Taiwan

5. Department of Aerospace and Systems Engineering

6. Feng Chia University

7. Taichung 40724

Abstract

The structural, mechanical, thermodynamic and electronic properties of two Ag–In phase crystals, i.e., AgIn₂ and Ag₃In intermetallic compounds (IMCs), are explored using ab initio calculations within the generalized gradient approximation.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA11142K

Reference52 articles.

1. Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

2. Gold coatings for fluxless soldering

3. J. H. Lau , C. P.Wong, N. C.Lee and S. W.Ricky Lee, Electronics Manufacturing with Lead-Free, Halogen-Free Conductive-Adhesive Materials, McGraw-Hill Handbooks, New York, 2003

4. Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

5. Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface Embedded Metal Nanowire–Liquid Metal–Elastomer Hybrid Composites for Stretchable Electronics;ACS Applied Materials & Interfaces;2024-03-08

2. Silver and Gold Containing Compounds of p-Block Elements As Perspective Materials for UV Plasmonics;ACS OMEGA;2023

3. Silver and Gold Containing Compounds of p-Block Elements As Perspective Materials for UV Plasmonics;ACS Omega;2023-04-12

4. Electronic structure and plasmonic activity in co-evaporated Ag-In bimetallic alloys;Journal of Alloys and Compounds;2022-03

5. Effect of Bonding Time on Microstructure and Shear Property of Cu/In-50Ag/Cu TLP Solder Joints;Journal of Electronic Materials;2020-04-24