Evaluation of Microscopic Nonuniformity at the Interface between Tin Plated Film and Copper Substrate
Author:
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Reference12 articles.
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4. 4) A. J. Schwartz, M. Kumar and B. L. Adams ; Electron Backscatter Diffraction in Materials Science, p. 231 (Kluwer Academic, 2000).
5. A new method for determining small misorientations from electron back scatter diffraction patterns
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