Study on the Generation of the Intermetallic Compound and the Occurrence of the Whiskers Observed in the Double-Layer Plating System (Sn/Cu)

Author:

Sakamoto Yoshinori1,Takemura Sayuri1,Yamazaki Wataru2,Shimura Masaomi2,Ishihara Sotomi1

Affiliation:

1. National Institute of Technology, Toyama college

2. FINECS CO., LTD.

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference15 articles.

1. 1) Y. Kadota: The Journal of Reliability Engineering Association of Japan 34(2012) 474-479.

2. 2) S. M. Arnold: Plating 53(1996) 96-99.

3. 3) M. Hino, K. Murakami, Y. Mitooka, K. Muraoka and M. Takamizawa: The Journal of the Surface Finishing Society of Japan 62(2011) 41-46.

4. 4) K. Murakami, M. Hino, M. Takamizawa and K. Nakai: J. Japan Inst. Met. Mater. 72(2008) 168-175.

5. 5) Y. Kadota: The Journal of Reliability Engineering Association of Japan 34(2012) 474-479.

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