Mechanism of Generation and Growth of Whiskers on Tin Electroplating-Reference-Cited by-同舟云学术

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Mechanism of Generation and Growth of Whiskers on Tin Electroplating

Published:2008 Issue:3 Volume:72 Page:168-175
ISSN:1880-6880
Container-title:Journal of the Japan Institute of Metals
language:ja
Short-container-title:J. Japan Inst. Metals

Author:

Murakami Koji,Hino Makoto,Takamizawa Masao,Nakai Kiyomichi

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://www.jstage.jst.go.jp/article/jinstmet/72/3/72_3_168/_pdf

Reference14 articles.

1. 3) B. B. He and K. L. Smith: Proceedings of The Fifth International Conference on Residual Stresses, (ICRS-5, Linkoping, Sweden, 1997).

2. 4) B. B. He, U. Preckwinkel and K. L. Smith: Advances in Xray Analysis, 42(1998).

3. 5) B. B. He: The 20th ASM Heat Treating Society Conference Proceedings, (St. Louis, Missouri, 2000).

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1. Study on the Length Distribution and the Growth Rate of Sn Whiskers Generated on Sn/Cu Plating System;Journal of the Japan Institute of Metals and Materials;2019-08-01

2. On Sn Whisker Suppressing Mechanism by Heat Treatment to the Double Layrer Plating System(Sn/Cu);Journal of the Japan Institute of Metals and Materials;2018

3. Study on the Generation of the Intermetallic Compound and the Occurrence of the Whiskers Observed in the Double-Layer Plating System （Sn/Cu）;Journal of the Japan Institute of Metals;2017

4. Formation and Growth of Tin Whiskers on Aluminum–Tin Alloys;MATERIALS TRANSACTIONS;2012

5. Formation and growth of tin whiskers on aluminum–tin alloys;Journal of Japan Institute of Light Metals;2011

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