Polyquaternium-2: A New Levelling Agent for Copper Electroplating from Acidic Sulphate Bath
Author:
Affiliation:
1. Shanghai Key Laboratory of Functional Materials Chemistry, East China University of Science and Technology
Publisher
The Electrochemical Society of Japan
Subject
Electrochemistry
Link
https://www.jstage.jst.go.jp/article/electrochemistry/84/6/84_15-E00167/_pdf
Reference47 articles.
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