Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath IV. Acceleration Mechanism in the Presence of Cl<sup>-</sup> Ions-Reference-Cited by-同舟云学术

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Mechanism of the Electrodeposition and Dissolution of Copper in an Acid Copper Sulfate Bath IV. Acceleration Mechanism in the Presence of Cl^- Ions

Published:1983-06-05 Issue:6 Volume:51 Page:460-464
ISSN:0366-9297
Container-title:Denki Kagaku oyobi Kogyo Butsuri Kagaku
language:en
Short-container-title:Denki Kagaku1961

Author:

YOKOI Masayuki,KONISHI Saburo,HAYASHI Tadao

Publisher

The Electrochemical Society of Japan

Subject

General Chemistry

Link

https://www.jstage.jst.go.jp/article/kogyobutsurikagaku/51/6/51_460/_pdf

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