Microelectrode Studies of S-NDR Copper Electrodeposition: Potentiodynamic and Galvanodynamic Measurements and Simulations

Abstract

Copper electrodeposition from a CuSO4—H2SO4 electrolyte containing a polyether suppressor and (0 to 100) μmol∙L−1 Cl− is examined using a 25 μm diameter microdisk electrode. Optical imaging during cyclic voltammetry and galvanodynamic measurements reveal hysteresis, overpotential inversions, and the morphological evolution accompanying breakdown of the polyether-chloride inhibition layer. Simulations involving co-adsorption of the suppressor-halide adlayer and its subsequent breakdown capture the positive feedback and negative differential resistance (S-NDR) evident in electroanalytical measurements as well as important aspects of electrode shape evolution. The impact of electrode shape change on simulations of electroanalytical experiments is quantified in comparison to a stationary interface approximation. For potentiodynamic conditions, adlayer breakdown propagates rapidly from the center of the microelectrode surface although the final deposit profile is non-uniform due to enhanced transport to the disk perimeter. In contrast, galvanodynamic experiments in more concentrated Cl− solutions reveal spatially selective suppressor breakdown with deposition initially localized to the microelectrode center followed by outward expansion as applied current is increased. The difference between potentiodynamic and galvanodynamic responses reflects the convolution of S-NDR critical behavior with the respective control-loop load lines. Microelectrodes constrain or frustrate the otherwise random bifurcation process giving rise to predictable morphologies unattainable on macroscale electrodes.