Spectroscopic Evidence for Hydrogen Diffusion through a Several-Nanometers-Thick Titanium Carbonitride Layer on Silicon
Author:
Affiliation:
1. Department of Chemistry and Biochemistry, University of Delaware, Newark, Delaware 19716
Publisher
American Chemical Society (ACS)
Subject
Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis
Link
https://pubs.acs.org/doi/pdf/10.1021/ja035026f
Reference16 articles.
1. TiN diffusion barriers for copper metallization
2. Improved TiN film as a diffusion barrier between copper and silicon
3. Characteristics of TiN barrier layer against Cu diffusion
4. Applicability of ALE TiN films as Cu/Si diffusion barriers
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