Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics-Reference-Cited by-同舟云学术

Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics

Published:2023-07-27 Issue:15 Volume:17 Page:14822-14830
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Han Won Bae¹^ORCID,Ko Gwan-Jin¹,Yang Seung Min¹^ORCID,Kang Heeseok¹^ORCID,Lee Joong Hoon¹^ORCID,Shin Jeong-Woong¹^ORCID,Jang Tae-Min¹^ORCID,Han Sungkeun¹,Kim Dong-Je¹,Lim Jun Hyeon¹,Rajaram Kaveti¹²,Bandodkar Amay Jairaj²³^ORCID,Hwang Suk-Won¹⁴⁵^ORCID

Affiliation:

1. KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea

2. Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States

3. Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (ASSIST), North Carolina State University, Raleigh, North Carolina 27606, United States

4. Center for Biomaterials, Biomedical Research Institute, Korea Institute of Science and Technology (KIST), 5 Hwarang-ro 14-gil, Seongbuk-gu, Seoul, 02792, Republic of Korea

5. Department of Integrative Energy Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea

Funder

KU-KIST Graduate School of Converging Science and Technology

National Research Foundation of Korea

Institute for Information and Communications Technology Promotion

Korea Medical Device Development Fund

Korea University

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

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